ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,622, issued on Sept. 22, was assigned to Altera Corp. (San Jose, Calif.). "Die-to-die power delivery" was invented by Ankireddy Nalamalpu ... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,624, issued on Sept. 22, was assigned to Kioxia Corp. (Tokyo). "Semiconductor memory device" was invented by Takafumi Masuda (Kawasaki, Ja... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,625, issued on Sept. 22, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device and method for fabricating the sa... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,626, issued on Sept. 22, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device having fuse component" wa... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,627, issued on Sept. 22, was assigned to IMEC VZW (Leuven, Belgium). "Semiconductor component with metal-insulator-metal capacitor assembl... Read More
WRIGHT-PATTERSON AIR FORCE BASE, Ohio, Sept. 24 -- The U.S. Air Force Institute of Technology issued the following news release: The Air Force received its first two Collaborative Combat Aircraft at ... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,628, issued on Sept. 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Embedding a metal-insulator-m... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,629, issued on Sept. 22, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manu... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,630, issued on Sept. 22, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package with impro... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,631, issued on Sept. 22, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France). "Integrated circuit package" was invented... Read More